Printed Circuit Boards (PCB) provides great consistency and is also extremely cost effectiveness as compared with other circuits like wire wrapped circuits or level to level circuits. Actually PCB supports the electronic systems automatically and builds a mechanical relationship between them utilizing conductive tracks, copper etched records and etched wiring. Although the preliminary cost is very high for the complex making Printed Circuit Boards but it gives you really reliable high performance.
Actually there are primarily three solutions which are applied by the manufacturers of PCB which also divides into subtractive techniques. In this procedure, copper layer is made on both or both side of a substrate. And after that, the unwanted excess copper is removed and the needed copper maintains as there is temporary mask. The conduit coating of copper with laminated overlay is utilized to comprise the PCB.
Epoxy material mainly creates the laminated cover of the board that is just like some type of hard plastic. This material has green color for which the board also looks green which is actually an epoxy of natural color. But it can also get other shades by utilizing other kinds of materials in laminating. This might be cotton paper with epoxy is generally known as woven glass merged with epoxy. But the regular product that is generally used in making PCB is the thin copper layer with eco-friendly mask epoxy. There also some undesirable copper on the substrate which needs to be removed. And the following procedure does this.
Photo Engraving is one of the most common processes used by the manufactures. In this process, the undesired copper is removed by chemical etching or photo mask process. This process works with photo plotter which is created by the technicians using computer software. Silk Screen printing is one more of the methods. This strategy includes etch proof ink which defends the required copper foils and removes the undesirable copper. PCB Milling utilizes plotter and commands of software to remove the undesirable copper from the substrate.